General Gaming Article |
- StarCraft II: Legacy of the Void Finally Dated
- Nvidia to Replace "Small Number" of Shield Pro Models with Ailing HDDs
- Microsoft to Unveil New Windows 10 Hardware on October 6
- Biostar Slaps Both DDR3 and DDR4 Slots on mATX Motherboard for Skylake
- PC Cooling Basics
| StarCraft II: Legacy of the Void Finally Dated Posted: 14 Sep 2015 06:01 PM PDT Blizzard to release third installment in NovemberOn Monday, Blizzard finally provided the launch date for the third installment of the StarCraft II "trilogy," Legacy of the Void. The PC game will hit the streets on November 10, 2015, just in time for the holidays. To celebrate the news, Blizzard has also launched the Legacy of the Void cinematic that will likely leave StarCraft II fans squirming in their seats for more. In addition to the launch date, Blizzard is also reminding customers that they can pre-purchase Legacy of the Void. By purchasing the game now, players will receive a prologue campaign called "Whispers of Oblivion" that consists of three missions, and early access to the multiplayer beta. "You are Hierarch Artanis, leader of the mighty protoss race," reads the game's description. "Years ago, your homeworld of Aiur fell to the merciless zerg Swarm. Now, at long last, you have raised a powerful fleet of warships known as the Golden Armada, and are poised to reclaim your world. But an ancient evil—Amon—threatens this destiny and the fate of the entire galaxy. Only you can reunite the protoss factions and defeat the coming darkness before it consumes all life in the sector." According to the product page, Legacy of the Void will provide new multiplayer units such as the Adept, Disruptor, Cyclone, Liberator, Ravager, and Lurker. Legacy of the Void will also come packed with automated tournaments that run once a day, pitting players of any skill level against each other. The "expansion" will even bring an Archon Mode to the StarCraft II table, which sees two players defending their base against two opposing players. If that wasn't enough, Legacy of the Void will add a new co-op game mode called Allied Commanders. The description says that two friends "fight hosts of enemies in action-packed, objective-driven missions." Players can level up to unlock new abilities and additional units. "Master the art of war with StarCraft legends such as Jim Raynor, Sarah Kerrigan, and Hierarch Artanis, and use their unique talents to turn the tide of battle in your favor," reads the description. If Legacy of the Void is your first dip into the StarCraft II pool, don't worry yourself about having to purchase the previous two installments, as Legacy of the Void is a standalone product. Customers can pre-purchase the game now for $40 (standard) or $60 (Deluxe). The latter bundle includes unique portraits, a Void Speeder mount, an Archon pet for World of Warcraft, a Protoss-themed card back for Hearthstone, and more. The first installment in the StarCraft II storyline is Wings of Liberty, which was released for Windows PC and Apple's OS X platform back in July 2010 (yes, it's been that long). The second installment, Heart of the Swarm, arrived in March 2013. |
| Nvidia to Replace "Small Number" of Shield Pro Models with Ailing HDDs Posted: 14 Sep 2015 02:05 PM PDT Partial Shield Pro recall Nvidia is putting the word out that some of its Shield Pro models have a hard drive issue that "worsen over time." The issue only affects models equipped with a 500GB hard disk drive, not the 16GB Shield units. Most users should never have any problems. According to Nvidia, the problem is present on less than 1 percent of 500GB Shield Pro devices. If you own one, be on the lookout for one of these symptoms:
It's a bit strange that a system update could trigger the issue. We suppose it could have something to do with bad sectors on the hard drive and the device not properly marking them, though that's just speculation on our part. Nvidia hasn't said why the issue might manifest during a system update, only that it's a telltale symptom. It should also be noted that waiting for the next system upgrade isn't a solution. Nvidia says if you own a model with a defective hard drive, future upgrades will also see the Fastboot error. If you have a faulty Shield Pro model, you can contact Nvidia at www.nvidia.com/nvcc for a replacement. Nvidia says it will advance ship a replacement as soon the RMA is approved. |
| Microsoft to Unveil New Windows 10 Hardware on October 6 Posted: 14 Sep 2015 10:51 AM PDT Surface Pro 4, anyone? Microsoft has begun sending invites to members of the press for an October 6 event in New York City. The invitations state that Microsoft has "some exciting news to share about Windows 10 devices," though stops way short of offering up any specifics. That's okay because the web is filled with leaked information, rumors, and speculation as to what Microsoft might have up its sleeve. One of the hardware items likely to make a debut is a Surface Pro 4 tablet, which would explain the recent sale promotions for the Surface Pro 3. Rumors are kind of all over the place in regards to the Surface Pro 4. Some state that Microsoft will opt for an Intel Core M foundation while others point to more burly Core i5 and Core i7 processor options. With Intel having announced a slew of Skylake processors, many of which are aimed at mobile devices, it seems probable the Surface Pro 4 will feature Skylake instead of Broadwell. It's also been said that Microsoft will introduce a second generation fitness wearable, the Microsoft Band 2, and new flagship phones, the Lumia 950 and Lumia 950 XL. You might also know the phones by their codenames, Talkman and Cityman. While nothing has been confirmed, it's believed the Lumia 950 will sport a 5.2-inch display and the Lumia 950 XL a 5.7-inch panel, both with a 2560x1440 resolution. The smaller sized device is also said to feature a 64-bit hexa-core Qualcomm Snapdragon 808 processor, 3GB of RAM, 32GB of internal storage, and a 3,000mAh battery, while the bigger Lumia 950 XL will get a Snapdragon 810 processor and 3,00mAh battery. |
| Biostar Slaps Both DDR3 and DDR4 Slots on mATX Motherboard for Skylake Posted: 14 Sep 2015 09:13 AM PDT Upgrade to Skylake without investing in new RAM Now that Intel's Skylake architecture is here, you might be contemplating a new build. You might also be fretting over the cost of new RAM -- up to this point, piecing together a Skylake build meant ditching your old DDR3 RAM and buying new DDR4 memory. Biostar has an alternative solution. The new Hi-Fi H170Z3 motherboard from Biostar sports two DDR3 DIMM slots and two DDR4 DIMM slots, meaning you can re-use your existing DDR3 memory today and upgrade to DDR4 tomorrow, if you wish. Interestingly Biostar isn't really putting much effort into promoting this advantage, which is arguably one of the main draws of the Hi-Fi H170Z3. As the name suggests, the board is based on Intel's H170 chipset. It's a micro ATX form-factor board with support for socket LGA 1151 processors. Some notable features include:
Biostar has a reputation as a budget brand, though this is yet another offering that supposedly uses higher-end components for added durability, including "Super Durable" 100 percent solid capacitors. The board also boasts a moisture-proof PCB, in case you live in a region where that might be advantageous. It doesn't appear as though the Hi-Fi H170Z3 is available to purchase yet, though when it does become available, the asking price will be $105 (MSRP). |
| Posted: 14 Sep 2015 12:00 AM PDT Keep it coolIt's summertime, which means that not just you need to stay cool—your PC does, too. If you're looking into how to chill down your PC, this guide will help get you started. We'll cover what generates heat and what effects heat has, ways to cool off components that need it, and tidbits of information to consider when setting up your cooling system. Sources of heat in a systemWhile all electronics give off some amount of heat, for many of them it is a negligible amount and doesn't require any special attention. However, there are a few components that give off a significant amount of heat. These are usually:
A general rule of thumb is that the higher the power consumption, the more heat the part will give off. This isn't always the case, though. For example, a power supply can consume 1000W+ from a wall socket, but it will not generate the same amount of heat that a video card consuming 250W will generate. Speaking of heat generated, there's an often cited value called Thermal Design Power, or TDP. A major issue with this value is that there's no real standard to measure it other than what is reported by the manufacturer of the part. It's more useful for those who build coolers, as this value represents the amount of heat energy a cooler must dissipate to allow the processor to run significant workloads for extended periods of time. Just to clear up some misconceptions though, here are two things about TDP you can take away: Lower TDP usually means both lower power consumption and lower heat generated. However, lower TDP does not mean lower operating temperatures. Two parts can run at the same operating temperature, but the cooler for the higher-TDP part will have to work harder to keep the same temperature. TDP is not the same as power consumption. TDP is for heat energy, not electrical energy. Physics just allows both forms of energy to be measured in watts. The effects of heatOver time, high heat accelerates wear and decreases reliability of the components. The reliability loss however, affects how stable the part is at a given performance level. If reliability issues start cropping up (due to, e.g., overclocking a processor very high and constantly running heavy loads), running the part at a lower performance level may eke out a bit more life before the system is no longer reliable. Another effect that heat has on components is thermal stress. When things get hot, they expand; when they cool off, they contract. Repeated heating/cooling cycles cause mechanical stress that can fatigue the material. At some point, the material cracks and breaks. Thermal stress is much more prominent if the temperature differences are wide. An interesting characteristic of semiconductor electronics is that it can exhibit thermal runaway. While the resistance of a semiconductor increases, at around 160° C, its resistance decreases. This causes more current to flow through the device, which causes it to get even hotter, until the chip burns up. Otherwise, heat doesn't affect anything else to a noticeable degree. Heat may cause performance degradation, but by way of the component throttling itself to prevent it from getting hotter. Types of coolingThere are several ways to cool off hot components in your rig. Each differ by what kind of physics magic they employ to do so. Air CoolingAn air-cooling solution that consists of a heatsink, heat pipes, and a fan. Air cooling uses the case's air as the primary cooling medium. Cooler air picks up the heat from a component and either airflow from case fans or natural convection (as heat rises) carries the hot air away. This is the most basic method of cooling, and costs the least. However, better air-cooling solutions can get bulky and heavy. Air coolers also requires a lot more airflow, which translates to more noise, to achieve the same operating temperature as other cooling methods. Air cooling components
Liquid CoolingLiquid cooling uses some kind of coolant, usually distilled water, as the primary cooling medium. Heat is picked up at the component and transferred to a radiator where air cooling takes over and cools off the liquid. An advantage of liquid cooling is that it has a much higher heat capacity than air, meaning it'll hold a lot more heat energy for a given temperature. This allows a liquid cooler to keep a component at a lower temperature than an air cooler for the same workload. Liquid cooling components
Types of Liquid CoolingClosed-loop system (aka all-in-one)This is a self-contained unit that includes the heat block, a pump, and a radiator. These are not user serviceable beyond installation and basic maintenance. That is, you cannot add additional tubing and parts to expand the loop. An example of a closed loop water cooler unit. Open-loop systemsThese are built piece by piece and are modular and customizable as a result. For example, you can start with a CPU cooling loop, but if you want to add the video card, you can do so down the road. Typical parts in an open loop are the heat block(s), radiator, pump, and reservoir with tubes connecting them all together. An example of an open-loop system. SubmergedThis dunks most of the hardware into a liquid, usually mineral oil for its inability to conduct electricity. The liquid may still be pumped out to a radiator for cooling. A submerged computer. Phase Change CoolingPhase change cooling works the same way that an air conditioner or refrigerator works: using the vaporization (liquid to gas) action of a working fluid to draw heat away or pump it elsewhere. You can see this work when you tilt a can of compressed air too much and spray on a surface. Phase change coolers can cool a component below the ambient temperature and often will cool below freezing. The drawback to that is condensation can build up and create an electrical short hazard. It's also very expensive; you won't have any use for one unless you're in overclocking competitions. An example of a phase change cooler, from LDCooling. Peltier CoolingPeltier cooling relies on the thermoelectric principle. When you apply electricity to a Peltier cooling module, one side becomes hot while the other side becomes cold. The cold side is applied to the component that needs cooling. The hot side is cooled off by one of the other methods. It's fallen out of use due to requiring another cooling system (usually liquid) anyway, as the hot side can get hot enough to burn out the unit. The cool side can also get cooler than ambient temperature, which creates a condensation hazard. A bare Peltier element. Cooling setup considerationsBefore thinking about overhauling your cooling setup or assembling components for a new build, here are some considerations to keep in mind. What kind of cooling?Air cooling, for the most part, works well enough for most people. Components might get uncomfortably hot if the ambient temperature is very warm, but most computer hardware that needs active cooling have the smarts to prevent themselves from going down in flames if the cooler can't keep up. If you're upgrading your air-cooling setup, consider getting beefier heat sinks first, then go tweak with the fans. Liquid cooling should be considered if you plan on overclocking heavily or if the computer is constantly doing heavy lifting in hot environments. Keep in mind that open-loop systems require a lot of investment and it makes the components being cooled harder to change out, depending on the availability of heat blocks. FansThere are two properties of fans to consider: airflow (measured in CFM) and noise (measured in dB). If you're looking for high airflow with low noise, look for larger fans. As far as noise is concerned, anything below 40dB will be very quiet, but start creeping up to 50dB and it'll be loud. Most case fans also have three pins to connect to the motherboard or controller. Some case fans have four pins, which use a different control method to handle how fast the fan spins. You can still plug a 4-pin connector into a 3-pin one, in which case the 4-pin connector will be keyed so that the correct pins are inserted. Connecting a 4-pin fan to a 3-pin socket. Case layoutA roomier case allows for more airflow inside and fewer places for air to become obstructed. Smaller cases can be worked with, but components that need airflow (usually the processor and video card) should have vents closeby. If you want to avoid the dust bunnies or fan noise, avoid cases with lots of openings. There's a minor debate over fan configuration in cases. The question is how many fans should draw in air (intake) and how many should blow out air (exhaust). This leads to two major configurations: Negative pressure: There is more air being exhausted than brought in. The idea is that hot air is exhausted quickly while cooler air gets sucked in throughout the holes of the case because the air pressure is lower inside. The problem is that this also allows dust to creep in everywhere in the case. Another point is that hot exhaust air may be drawn back into the case. Positive pressure: There is more air being brought in than exhausted. The idea is that this creates a clean-room environment in the case. Now dust cannot slip in through the cracks, only through the fans that draw air in. This also prevents any hot exhaust air from being drawn back in. How positive and negative case pressure works (from SilverStone). No matter what camp you choose, the important thing is to keep the air flowing. Your PC needs some cleaning once in a whileIf taxes and death are inevitable, then so is dust accumulating in a PC in a typical home. As long as air flows through the computer, dust will follow and build up. Dust is an excellent insulator of heat, which will cause components to get caked with it and become less efficient at cooling. Your PC should be cleaned of dust at least once a month, more or less often depending how clean your environment is. Compressed air cans can be purchased at most electronics stores, but a better investment if you clean often is to get an electric duster. Do not use a hand duster, especially something like a Swiffer, as these can build up static charges that can damage the hardware. |
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